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铜业工程:2021(6):6-8
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固溶温度对 C70250 合金综合性能的影响
(凯美龙精密铜板带(河南)有限公司,河南 新乡 453000)
Effect of Solid Solution Temperature on the Comprehensive Properties of C70250 Alloy
(KMD Precise Copper Strap(Henan)Co, Ltd, Xinxiang 453000, Henan, China)
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投稿时间:2021-03-22    
中文摘要: 采用光学显微镜(OM)、扫描电子显微镜(SEM)、电导率测量仪,力学性能测试及折弯试验研究了固溶温度对 C70250 合金的微观结构、导电性能、机械性能、折弯性能的影响。通过试验得出,固溶温度从 720℃调整为 900℃,在相同冷变形及时效热处理工艺下,强度更高,导电性略有降低,沉淀析出物更加均匀且折弯性能表现更加优越。
Abstract:The effects of solution temperature on the microstructure, electrical conductivity, mechanical properties and bending properties of C70250 alloy were investigated by optical microscope (OM), scanning electron microscope (SEM), electrical conductivity measuring instrument, mechanical property test and bending test. The results show that when the solution temperature is adjusted from 720℃ to 900℃, the strength is improved, the electrical conductivity is reduced, the precipitates are more uniform and the bending performance is better under the same cold deformation and aging treatment processes.
文章编号:20210602     中图分类号:TG146
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引用文本: 张英,刘兆洋,鲁长建.固溶温度对 C70250 合金综合性能的影响[J].铜业工程,2021,(6):6-8