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投稿时间:2021-04-21
投稿时间:2021-04-21
中文摘要: 在5G通信技术及消费电子行业快速发展的背景下,铜基薄壁热管被广泛应用于大功率电子设备散热领域。通过介绍目前应用较广的几种热管,对其结构、特点及应用范围进行了对比 ;阐述热管在加工制备和使用过程中存在的一些问题和缺陷,对表面缺陷形成机理进行分析,并对热管未来的发展趋势进行了展望。
Abstract:In the context of the rapid development of 5th generation wireless systems and consumer electronics industry, the thinwalled heat pipe is widely used in high-power electronic equipment heat dissipation. This article describes several kinds of heat pipes, comparison of their structures, features and applications; describes some problems and defects in the process of processing and use, analyzes the formation mechanism of surface defects, and the future development trend of heat pipes.
keywords: heat pipe heat dissipation technology suction core heat pipe defect surface quality development trend
文章编号:20220201 中图分类号:TG146.1+
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基金项目:中国科学院重点部署项目(ZDRW-CN-2021-3)
引用文本:
李洋,王松伟,刘劲松,张士宏,韩秋水,胡宽雨.铜基薄壁热管应用现状及发展趋势[J].铜业工程,2022,(2):1-7


