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投稿时间：2022-01-05
投稿时间：2022-01-05
中文摘要: 某铜业公司电解厂在 2020 年 2 月份出现阴极铜底部长大面积粒子，当月阴极铜平均返修率急剧升至 10.45%，远高于正常生产时的 4%。通过分析阴极铜底部结粒的原因，并及时采取有效应对措施，消除了阴极铜底部长大面积粒子，将阴极铜返修率降至 4% 以下，提高了阴极铜质量。
Abstract:The problem of considerable nodules forming on the bottom of the cathode copper and the unqualified cathode copper rate rising sharply up to 10.45% at X copper tank house in February 2020 was introduced. The reason for the nodules forming on the bottom of the cathode copper was analyzed, and then counter measures were taken to eliminate nodules at the bottom of the cathode copper, resulting in reducing the unqualified cathode copper rate under 4% as well as improving cathode copper quality.
文章编号：20220210 中图分类号：TF811
基金项目:
引用文本：
陈世民.阴极铜底部结粒原因分析及应对措施[J].铜业工程,2022,(2):42-45
