Abstract:As an important functional basic material in the electronic circuit industry, copper foil is widely used in the fields of printed circuit boards, copper clad laminates and lithium-ion batteries. Particle defects are typical quality problems of electrolytic copper foil. Firstly, the production process of electrolytic copper foil is described one by one, and the surface morphological characteristics and hazards of the particle defect are described in detail. Then, combined with many years of production practice experience, the causes of the typical particle defect which are focused on green foil copper tumor, surface copper plating, chip copper powder and foreign matters etc., are analyzed one by one. Lastly, a set of effective measure of controlling particle defects in the whole process is summarized from monitoring the effect and service life of the filter, dealing with the insulation and sealing of the raw foil machine, optimizing the additive formula, controlling the working condition of the conductive roller of the processor, adjusting and replacing the cutter, and ensuring the external environment.