铜业工程:2023(3):40-45
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Cu-20%Ag合金冷拉拔变形过程导电特性研究
张朋飞1, 周延军1, 柳亚辉1, 李韶林1, 宋克兴1,2, 曹军3, 吴保安4, 高岩2, 岳鹏飞2
(1. 河南科技大学材料科学与工程学院;2. 河南省科学院;3. 河南理工大学机械与动力工程学院;4. 重庆材料研究院有限公司)
Electrical Conductivity Characteristics of Cu-20%Ag Alloy During Cold Drawing Process
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投稿时间:2023-04-11    修订日期:2023-05-10
中文摘要: 通过定向凝固+冷拉拔变形工艺制备了不同线径的Cu-20%Ag(质量分数)合金微细丝线材。通过扫描电子显微镜(SEM)观察了不同线径的Cu-20%Ag合金线材的微观组织演变,发现在拉拔变形过程中, Cu-20%Ag合金线材内部晶粒不断细化,共晶区域较之铜基体区域更为明显,当真应变为 8.13 时线材内部的共晶纤维细化至平均宽度 500 nm 左右。研究了 Cu-20%Ag 合金冷拉拔变形过程中组织性能的演变规律,探明了其组织演变对导电率变化的影响机理。Cu-20%Ag合金在拉拔变形过程中晶粒的细化和破碎导致的晶界面积增加是导电率降低的主要原因。
Abstract:Cu-20%Ag (mass fraction) alloy micro-fine wires with different diameters were produced by directional solidification and cold drawing deformation. The microstructure evolution of Cu-20%Ag alloy wires with different diameters was observed by scanning electron microscopy. During the drawing process, the internal grains of Cu-20%Ag alloy wires underwent continuous refinement. The eutectic region exhibited more pronounced changes than the copper matrix region. At a true strain of 8.13, the eutectic fibers inside the wire were refined to an average width of about 500 nm. The evolution rule of the microstructure and properties during cold drawing deformation of Cu-20%Ag alloy was studied, and the influence mechanism of the microstructure evolution on the change of conductivity was explored. Grain refinement and fragmentation in Cu-20%Ag alloy during drawing deformation led to an increase in the interfacial area of the grains, which was the main reason for the decrease in conductivity.
文章编号:20230411001     中图分类号:TG146.1+1
基金项目:国家自然科学基金项目(U21A2051,52173297,52071133);中原学者工作站资助项目(214400510028,224400510025);河南省科学院科研开发专项(220910009)
引用文本: 张朋飞,周延军,柳亚辉,李韶林,宋克兴,曹军,吴保安,高岩,岳鹏飞.Cu-20%Ag合金冷拉拔变形过程导电特性研究[J].铜业工程,2023,(3):40-45