Abstract:The emergence and rapid development of the fifth-generation mobile communication technology has triggered the development of electronic devices, especially smart phones and tablets PC, towards high performance, high integration and miniaturization, further leading to ultra high heat flux in extremely narrow space. As an high efficient heat transfer element, vapor chamber with low resistance and good temperature uniformity is widely used in the heat dissipation module of high heat flux equipment. In this paper, a detailed overview of vapor chamber is firstly presented, including advantages, principle, and structures. The present situation of modeling and simulation of vapor chamber is summarized and the effect of manufacturing technology on heat transfer performance of vapor chamber are analyzed and evaluated. The performance evaluation indicators are then provides. In this paper, the preparation method of micronano wick with copper material and the reliability evaluation method of vapor chamber are put forward. Based on the above, the applications and research trends are prospected.