Abstract:Copper film was deposited both sides on a single-sided silver-plated YBa2Cu3O7-δ high-temperature superconducting tape using the magnetron sputtering method. Subsequently, electroplating was used to thicken the copper layer. The critical current of copper plated magnetron sputtering samples was measured by four probe lead method in liquid nitrogen temperature region. The room temperature resistance of the superconducting surface on the composite plating sample and electroplating sampled and sputtering sampled was tested using the four-probe lead method. The surface morphology of magnetron sputtering copper plated and electroplated copper samples was analyzed by scanning electron microscopy (SEM). Samples at the same time by the method of four point probe lead composite plating, electroplating, sputtering plating samples of superconducting surface contact resistance were tested at room temperature. Finally, the bending method was used to test the double-sided bonding force of the samples prepared by electroplating process and composite plating process. The results indicated that the critical current of YBa2Cu3O7-δ could be affected by simultaneous double-sided sputtering deposition. The surface roughness of the sputtering plating copper sample was less than copper plating samples, when sputtering copper layers of different thickness in composite plating, the surface resistance changed. The contact resistance at room temperature of the superconducting surface of the sputter-plated sample under the same film thickness was about 13% of that of the traditional electroplated copper. The binding force of superconducting surface was enhanced compared with electroplating method, but the adhesion strength of the opposite belowed plating method. This method in YBa2Cu3O7-δ tape applications would have broad prospect of application.