Abstract:Electrolytic copper foil is extremely prone to problems such as copper foil warpage during the production process, which seriously affects the subsequent processing and assembly of copper foil, and is one of the key common problems of electrolytic copper foil. In this paper, the effect of collagen on the warpage of electrolytic copper foil was investigated by using different concentrations of collagen as additives, and the mechanism of its action was discussed. The results showed that the optimum amount of collagen was 10 mg/L, at which the tensile strength of copper foil reached 382.5 MPa, and the warpage was greatly reduced to 16 mm. The tensile strength of copper foil increased with the increase of collagen concentration. Collagen significantly improved the warpage of copper foils by promoting the formation of (220)Cu crystal optimum orientation and reducing the surface roughness of copper foils. By adding 10 mg/L collagen, the weaving coefficient (Tc) of the (220)Cu crystal faces of the copper foil increased to 57.8%, the roughness of the roughness of the gross surface decreased to 1.9 μm, and the warpage was reduced to 16 mm. Due to the residue of collagen inside the copper foils, the copper foils were caused to undergo self-annealing behavior. The self-annealing of the copper foil released some of the residual stress and further reduced the warpage of the copper foil to 9 mm. Therefore, collagen was an effective additive to reduce the warpage of copper foils and could further reduce the warpage of copper foils through the subsequent self-annealing behavior.