Abstract:With the rapid development of 5G technology and high-performance computing, the power density of electronic devices increases abruptly. This leading to an increased demand for effective heat dissipation. Structure optimization is key to enhance heat dissipation efficiency of those devices. However, conventional manufacturing techniques have limitations when dealing with complex structures. These limitations hinder the exploration of superior heat dissipation components. Additive manufacturing technology, employing a layer-by-layer accumulation approach, enables the creation of structures with complex internal geometries and, thus, facilitates the production of high-performance heat dissipation components. This paper provides a comprehensive overview of the recent progress of heat dissipation structure fabrication based on additive manufacturing. Firstly, the methods and fundamental materials of additive manufacturing technology are introduced. Secondly, the latest progress in development of microfluidic heat sinks, heat pipes/homogenized plates, heat sinks, and other heat sinks using additive manufacturing technologies is reviewed. Finally, the design methods for optimizing heat dissipation structures are summarized. This paper emphasizes the heat dissipation structure optimization using additive manufacturing technology. It provides useful reference value to cope with the increasing heat dissipation demand in electronic devices, aerospace, 5G communication, mobile devices, automotive, phased radar, flexible wearable and other fields.