Abstract:China""s electronic information sector is experiencing rapid growth, with integrated circuits emerging as a pivotal foundation for the nation""s economic infrastructure. This article encapsulates the current standing of copper alloys utilized in IC leadframes, systematically reviews the distinctive attributes of alloy systems such as Cu-Fe-P, Cu-Cr-Zr, Cu-Ni-Si tailored for leadframes, alongside the effects of intricate micro-alloying techniques on the structure and performance attributes of these copper alloys. It further delineates the fabrication and processing methodologies employed for leadframe copper alloy strips, shedding light on the innovative features of a novel, streamlined production process centered around horizontal continuous casting. Lastly, it offers insights into the future prospects and trajectory of development for IC leadframe copper alloys within the Chinese context.