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投稿时间:2024-06-11 修订日期:2024-08-04
投稿时间:2024-06-11 修订日期:2024-08-04
中文摘要: 无氰亚硫酸盐电沉积金体系面临电流效率低、镀液稳定性差、循环周期短、镀层性能难以满足工业发展需求等问题。为了提高电流效率、镀液稳定性和镀层表面光泽度,改善电沉积金形貌及提高镀层性能,配制了亚硫酸金钠电镀液体系,通过添加不同质量浓度乙二胺(EDA)作为辅助添加剂,研究了EDA对镀液稳定性、电沉积产物表面形貌、元素组成和晶体晶面取向,以及金镀层光泽度、硬度和粗糙度的影响。采用电化学测试进一步研究EDA对溶液中Au+行为的影响。结果表明:EDA使吸附Au+的活性位点增加了2.8倍,同时增加了阴极表面的极化并促进晶粒细化,增强了 Au(111)晶面的峰强度。EDA 质量浓度为 15 g/L 时,电镀液能保存 6个月以上,电流效率从 54% 提高到98%,金镀层表面均匀性、光泽度和硬度明显提高,镀层表面粗糙度、腐蚀速率明显降低,镀层综合性能最优。本研究有望为亚硫酸盐电镀体系开发新型高效添加剂提供借鉴,有助于推动电镀金行业的可持续发展。
Abstract:Cyanide-free sulfite electrodeposited gold system has the disadvantages of low current efficiency, poor stability of plating bath, short cycle period. To improve the current efficiency, the stability of the plating bath and the surface gloss of the coating, the electrodeposited gold morphology and the performance of the coating are improved. In this paper, sodium gold sulfite electroplating solution was prepared with different concentrations of ethylenediamine (EDA) as additives. The effects of EDA on the stability of plating solution, surface morphology, element composition and crystal orientation of electrodeposited products, and gloss, hardness and roughness of gold coating were studied. The effect of EDA on Au(I) behavior in solution was further studied by electrochemical testing. The results show that EDA increases the active site of Au+ adsorption by 2.8 times, increases the polarization of cathode surface, promotes grain refinement, and enhances the peak strength of Au(111) crystal surface. When the EDA concentration is 15 g/L, the electroplating solution can be stored for more than 6 months, the current efficiency increases from 54% to 98%, the surface uniformity, gloss and hardness of the gold coating are significantly improved, the surface roughness and corrosion rate of the coating are significantly reduced, and the comprehensive performance of the coating is the best. The research results are expected to provide reference for the development of new high-efficiency additives for sulfite plating system, and help promote the sustainable development of gold electroplating industry.
keywords: cyanide-free gold electroplating sulfite ethylenediamine hardness corrosion resistance electrochemistry
文章编号:20240611002 中图分类号:TQ153.1+8
基金项目:国 家 重 点 基 础 研 究 发 展 计 划 项 目(2022YFC3900801);国 家 自 然 科 学 基 金(52274349);福 建 省 产 学 研 合 作 项 目(2023H6007,S20241038612);福建省自然科学基金项目(2023J05024)
引用文本:
衷水平,徐婷钰,陈江濠,迟晓鹏,谭文,翁威,唐定.乙二胺添加剂对无氰亚硫酸盐体系电沉积金的影响[J].铜业工程,2024,(4):44-54


