Abstract:The analysis and of impurity components in waste electronic grade copper wire is investigated by inductively coupled plasma mass spectrometry (ICP), X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), scanning electron microscopy (SEM) and so on. On this basis, different methods and processes were used to remove the impurities in the sample. The results showed that the surface of waste electronic copper wire was slightly oxidized and contained impurities such as C, Si, S, Ca, Al, Ni, etc. after vacuum hightemperature decomposition pretreatment. There were many kinds of impurities, but the content was relatively low. The combined process of scrubbing and ultrasonic cleaning could effectively reduce the content of C impurities in the copper wire. The removal rate of C could reach more than 90%. Then, the sample was subjected to 30 min of acid washing with 5% concentration sulfuric acid, which could effectively reduce the content of impurities in the copper surface. Finally, after scrubbing ultrasonic acid washing water washing process, a regenerated copper wire with a purity of 99.95% could be obtained. This method could separate impurities at low cost and efficiently recover high-purity regenerated copper, which was of great significance for the resource utilization of unpainted copper wire.