Abstract:The thermal compressed deformation experiments of as-cast CuSn10P1 alloy were conducted based on the Gleeble-3500 thermo-mechanical simulation testing platform. The thermal compressed deformation behavior of as-cast CuSn10P1 alloy was systematically explored at the deformation temperature range of 450~550 ℃ and strain rate of 0.01~1 s-1. By analyzing the effect of the coupling temperature and strain rate on the true stress-true strain curve, the constitutive model of the alloy was established, and the activation energy of thermal deformation and critical conditions of dynamic recrystallization were determined. Flow stress was negatively correlated with the deformation temperature and positively correlated with the strain rate. According to the model fitting calculation, the thermal deformation activation energy (Q) and stress index (n) of as-cast CuSn10P1 alloy were 224.52 kJ/mol and 3.8037, respectively, indicating that the hot deformation mechanism was dislocation climb considering the results of microstructure characterization. The dynamic recrystallization behavior was more likely to be triggered under the conditions of high temperature and low strain rate.