Abstract:High-purity gold (Au) and gold targets are among the fundamental raw materials for integrated circuit and semiconductor chip manufacturing, primarily used in metallization systems of high-end chips and advanced packaging. In order to protect the supply chain security of China's high-end chips, Chinese enterprises are constantly devoted to the research and development and industrialization of high-purity gold and gold target preparation technology. This paper outlined the technical requirements and preparation challenges of high-purity gold and gold targets for semiconductor applications, providing an overview of global preparation technologies and research advancements, and analyzed the advantages and disadvantages of various methods. In the preparation of high-purity gold, the direct chemical reduction method features short processing flow and high efficiency but suffers from unstable product quality. The solvent extraction-reduction method ensures stable quality and high purity yet causes severe environmental pollution. The electrolysis method delivers high quality and purity with low cost but requires extended production cycles. The primary method for preparing gold targets was the melting-thermomechanical processing method, which achieved an average grain size of less than 100 μm in the resulting products. The preparation of high purity gold and gold target for semiconductor chips must be combined with the advantages of various purification processes and adopt a variety of combined processes in order to stably remove specific impurities and meet the high purity gold standard for semiconductors.