Abstract:To enhance the high-temperature oxidation resistance of high-purity oxygen-free copper wire, this study prepared copper wires using 6N high-purity copper as the matrix with trace additions of Ag, P, Cr and Ni. Oxidation behavior of the wires in air at 300, 400, and 500 ℃ was systematically investigated. Scanning electron microscopy (SEM) and X-ray diffraction (XRD) were employed to analyze the morphology, thickness, and phase composition of the oxide films. Results indicated that the introduction of trace elements significantly affected the characteristics of the oxide films. Ag addition thickened the oxide film and promoted formation of CuO at high temperatures. P incorporation refined the oxide film structure and inhibited oxygen diffusion. Synergistic effect of Cr and Ni effectively enhanced the density of the oxide film and promoted Cu2O formation, significantly strengthening the texture of Cu(111) and other crystal planes, thereby improving overall oxidation resistance