Abstract:In this paper, Cu-0.5Cr and Cu-0.5Cr-0.1Ti-0.1Ag alloys were used as experimental materials to study the effects of simultaneous addition of Ti and Ag elements on the microstructure and the mechanical/electrical properties of Cu-Cr alloys. The results showed that the two alloys, Cu-0.5Cr and Cu-0.5Cr-0.1Ti-0.1Ag, reached the peak aging state when annealed at 450 ℃×1 h. The addition of Ti and Ag significantly improved the hardness of the Cu-Cr alloys, but the electrical conductivity was reduced. At the same time, the high-temperature anti-softening behaviors of the two alloys were investigated, and it was found that the softening process was accompanied by grain recovery and recrystallization, and the addition of Ti and Ag improved the recrystallization activation energy of Cu-Cr alloys, slowed down the recrystallization process of the alloys in the softening process, which resulted in the higher softening temperatures of Cu-0.5Cr-0.1Ti-0.1Ag alloys by 25 °C compared with that of Cu-0.5Cr alloys.